Samsung and Broadcom Sign $200 Billion AI Chip Collaboration Agreement
Samsung
Broadcom
Samsung Electronics and Broadcom signed a memorandum of understanding on strategic cooperation valued at over $200 billion through 2030. The agreement includes manufacturing logic chips using Samsung Foundry's advanced process nodes, development of HBM memory, and use of packaging technologies.
Samsung Electronics has announced the signing of a strategic cooperation memorandum with Broadcom worth over $200 billion, extending through 2030. According to Bloomberg, this amount reflects the total volume of cooperation between the parties over several years, rather than the value of a one-time contract. The agreement covers the production of logic chips using Samsung Foundry's advanced process technologies, the development of next-generation HBM memory, and the use of advanced packaging technologies.
Source: 3DNews —
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