Glass Substrate Packaging Becomes New Industry Focus as Panel Makers Diversify

At a recent ChinaJoy event, Zhao Jun, Senior Vice President of TCL Technology and CEO of TCL CSOT, disclosed that TCL CSOT has assembled a professional team to advance key process validation for glass substrate packaging, with plans to showcase related samples in the second half of the year and establish a pilot production line. Meanwhile, BOE's glass substrate packaging carrier trial line, backed by an investment of 993 million yuan, has sent samples to domestic customers, and some clients have passed concept certification and entered technical testing. Additionally, Shenzhen Tianma has built an MPG multi-project glass substrate technology platform, listing advanced packaging as one of its key empowerment directions. As AI chips evolve toward larger sizes, higher computing power, and higher-density interconnections, traditional organic substrates are gradually reaching performance limits, making glass substrate advanced packaging the new focus of industry competition, with panel makers leading this cross-sector expansion.