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Samsung and Broadcom Sign $200 Billion AI Chip Collaboration Agreement

Samsung Electronics and Broadcom signed a memorandum of understanding on strategic cooperation valued at over $200 billion through 2030. The agreement includes manufacturing logic chips using Samsung Foundry's advanced process nodes, development of HBM memory, and use of packaging technologies.

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Broadcom

3DNews26.07 · 15:02

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The AI Boom Gets More Expensive: Loan Rates for Data Center Construction Rise

Due to the AI boom, American tech giants are increasingly borrowing funds for data center construction, but lenders are raising interest rates. Meta recently secured financing at a rate above 7%, which is 0.4 percentage points higher than last year, indicating growing lender concerns about the profitability of such projects.