YMTC

China Shifts Chip Race Strategy: Billions to AI, HBM, and Advanced Packaging

China's 'Big Fund' has entered its third phase, redirecting billions in subsidies toward advanced chip packaging, equipment, materials, and AI chip development. The previous phases focused on broader industry areas, lifting companies like SMIC and YMTC. The third phase prioritizes advanced packaging technologies, HBM memory, and AI accelerators.

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