Russian Authorities Accelerate AI Integration into EDA for Microelectronics

The Russian Ministry of Industry and Trade (Minpromtorg) is accelerating the integration of artificial intelligence into domestic electronic design automation (EDA) tools for microelectronics. According to a presentation by Vladimir Dozhdev, director of the digital technologies department, three R&D projects (OKR) are planned for 2029: 'SAPR Tsifra-Pro' (digital design), 'SAPR Analog-Pro' (analog design), and 'SAPR SVCh-Pro' (microwave design), with the timeline moved earlier due to the rapid development of AI and completion of preliminary work. The AI integration aims to improve technical characteristics and address tasks like power rail analysis. Experts note potential applications include reverse engineering in CAD, where AI builds models from 3D scanning point clouds, and generating manufacturing process prototypes in CAPP/CAM systems. The overall roadmap includes other projects, such as the completed 'Obsidian' demonstrator for 180nm technology and ongoing work on tools for various process nodes. Total R&D costs for domestic EDA tools by 2030 are estimated at 54.6 billion rubles, aiming for over 90% adoption in Russian design centers, which currently rely on foreign tools from Synopsys and Cadence that ceased support after 2022.