AMD EPYC Venice Deep Dive: 256 Cores, 2nm TSMC, Two Sockets and Liquid Cooling as a Necessity
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AMD has unveiled its sixth-generation EPYC 9006 'Venice' server processors at the Advancing AI event. The new lineup, built on the 2nm TSMC process with GAAFET transistors, offers up to 256 cores, 1 TB of L3 cache, and PCIe Gen 6 support. The platform introduces two new sockets (SP7 and SP8), requiring a full platform upgrade. AMD claims significant performance gains over previous generations and competing Intel Xeon processors.
On July 22, 2026, at the AMD Advancing AI conference in San Francisco, AMD introduced the sixth-generation EPYC 9006 'Venice' server processors based on the Zen 6 architecture. The flagship EPYC 9996 offers 256 cores and 512 threads, up to 1 TB of L3 cache, and a 600W power envelope. The processors are manufactured on TSMC's 2nm process node (N2) using GAAFET nanosheet transistors, marking a shift from FinFET. The lineup is split across two new sockets: SP7 (with up to 16 DDR5-8000 memory channels and up to 1.6 TB/s bandwidth) and SP8 (8 channels, lower power). Both sockets support PCIe Gen 6 with up to 160 lanes in dual-socket configurations, and CXL 3.1. AMD has added new AVX-512 instructions for AI workloads, including AVX512_FP16 and AVX_VNNI_INT8. Compared to the previous EPYC 9005 'Turin' generation, the new chips offer an 80% performance and efficiency improvement and a 30% increase in thread density, according to AMD. The company also replaced the TDP metric with 'Default CPU Power.' AMD's own benchmarks show significant advantages over Intel Xeon 6980P and AWS Graviton5 in workloads like NGINX, TPCx-AI, and FAISS vector search. The author from Selectel notes that the move to two incompatible sockets increases platform complexity and costs, and that liquid cooling is becoming inevitable for 600W processors. Independent benchmarks are awaited, with Phoronix planning unrestricted testing.
- Abbreviations
- CCD = Core Complex Die — вычислительный чиплет
- CXL = Compute Express Link — Compute Express Link
- DDR5 = Double Data Rate 5 — DDR5
- FinFET = Fin Field-Effect Transistor — транзистор с плавниковым затвором
- GAAFET = Gate-All-Around Field-Effect Transistor — транзистор с круговым затвором
- I/O = Input/Output — ввод/вывод
- L3 = Level 3 cache — кэш 3-го уровня
- PCIe = Peripheral Component Interconnect Express — PCI Express
- TDP = Thermal Design Power — расчетная тепловая мощность
Source: Habr — хаб ИИ —
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