SK hynix accelerates development of 3D-stacked DRAM for AI systems
SK hynix has accelerated the development of DRAM with 3D stacking on top of a logic die for next-generation AI systems, including mobile devices. The company is recruiting engineers through its U.S. subsidiary and has already signed a customer agreement to develop solutions based on this technology.
SK hynix
3DNews26.07 · 15:02
